发明名称 |
Semiconductor Package with Perforated Substrate |
摘要 |
A semiconductor package includes a substrate and a semiconductor chip which includes an active surface with a plurality of chip contact areas. The chip is electrically connected to the substrate. The substrate includes a sheet of core material, a plurality of upper conducting traces and upper contact pads on its upper surface, a second plurality of lower conductive traces and external contact areas on its bottom surface. A plurality of conducting vias connect the conducting traces and lower conducting traces. The substrate also includes a plurality of vent holes and a layer of solder resist covering the upper and lower surfaces of the substrate leaving the contact areas free from solder resist.
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申请公布号 |
US2008150159(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
US20040588927 |
申请日期 |
2004.02.11 |
申请人 |
ABERIN IRWIN;OFNER GERALD;HONG YEO ALFRED SWAIN;ZHU WEN HUI |
发明人 |
ABERIN IRWIN;OFNER GERALD;HONG YEO ALFRED SWAIN;ZHU WEN HUI |
分类号 |
H01L23/48;H01L21/56;H01L23/00;H01L23/13;H01L23/31;H01L23/498;H05K1/00;H05K3/28;H05K3/30;H05K3/42 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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