发明名称 Structure of a heat dissipating module
摘要 A heat dissipating module includes a plurality of heat dissipating fins stacking together in a parallel manner, a plurality of base boards soldering on the heat dissipating fins and a heat transfer duct running through the heat dissipating fins. Each of the dissipating fins has a first portion and a second portion which is formed by bending two sides of the first portion forwards in a vertical manner. The second portion on the same side is coupled to form a coupling surface which is soldered on the base boards. By incorporating the heat transfer duct a firmer heat dissipating module structure is formed.
申请公布号 US2008149314(A1) 申请公布日期 2008.06.26
申请号 US20060641701 申请日期 2006.12.20
申请人 CHENG HOME ELECTRONICS CO., LTD. 发明人 TSOU TUNG-HSING;WEN CHENG-KANG;LI CHANG-LUNG
分类号 F28F1/30 35;A61P9/10 主分类号 F28F1/30
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