发明名称 |
Structure of a heat dissipating module |
摘要 |
A heat dissipating module includes a plurality of heat dissipating fins stacking together in a parallel manner, a plurality of base boards soldering on the heat dissipating fins and a heat transfer duct running through the heat dissipating fins. Each of the dissipating fins has a first portion and a second portion which is formed by bending two sides of the first portion forwards in a vertical manner. The second portion on the same side is coupled to form a coupling surface which is soldered on the base boards. By incorporating the heat transfer duct a firmer heat dissipating module structure is formed.
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申请公布号 |
US2008149314(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
US20060641701 |
申请日期 |
2006.12.20 |
申请人 |
CHENG HOME ELECTRONICS CO., LTD. |
发明人 |
TSOU TUNG-HSING;WEN CHENG-KANG;LI CHANG-LUNG |
分类号 |
F28F1/30
35;A61P9/10 |
主分类号 |
F28F1/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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