BRAZED FLIP-CHIP MOUNTING OF INTEGRATED CIRCUITS

摘要

A method of flip-chip mounting a circuit to a substrate is provided by brazing together metallic elements formed on both the circuit and substrate. The brazing being achieved by initiating a chemical exothermic reaction in a multilayer stacked material disposed between the metallic elements on the circuit and substrate. Advantageously the chemical exothermic reaction provides a means of locally brazing the metallic elements without necessitating raising the circuit and substrate to a high temperature such as required in conventional flip-chip assembly with solder reflow. According to an exemplary embodiment of the invention the metallic elements are electrical conductors and an electrical trigger signal is provided via the metallic elements to initiate the chemical exothermic reaction.