| 摘要 |
<p>[PROBLEMS] A sheet bonding device and sheet bonding method capable of, even if a plate-like member and frame having different thicknesses are supplied, reliably bonding a sheet to both of them. [MEANS FOR SOLVING PROBLEMS] First, second, and third single axis robots (16, 18, 19) are individually controlled, and the robots (16, 18, 19) function as means for moving respectively a press roller (2), an inner table (4), and an outer table (5). A wafer (W) and a ring frame (F) are integrated together by moving the press roller (2) according to the thickness of a dicing table (DT), moving the inner table (4) according to the thickness of the wafer (W), and moving the outer table (5) according to the thickness of the ring frame (F). In this process, the position at which the dicing table (DT) and the upper side of a wafer (W) are in contact with each other is defined as a bonding reference point (P).</p> |
