| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a treatment device capable of executing processing high in productivity such as processing efficiency and processing accuracy by executing a plasma treatment and blasting without changing the device. <P>SOLUTION: This treatment device 1 is provided with a plasma treatment device 11, a blasting device 21 and a workpiece installation part 100 for installing a workpiece 10 thereon, and executes a plasma treatment and blasting to the workpiece 10 installed on the workpiece installation part 100 at the same time or in a predetermined order by using the plasma treatment device 11 and the blasting device 21. <P>COPYRIGHT: (C)2008,JPO&INPIT |
