| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film free from increase in connecting resistance and exfoliation of adhesive in a connecting portion, and capable of manufacturing a circuit board extremely improving a connection reliability. SOLUTION: A liquid solution is obtained by dissolving a phenoxy resin and an acrylic rubber into an ethyl acetate. A liquid epoxy containing microcapsule latent hardener is added to the liquid solution and agitated to obtain a liquid solution for application to molten silica and nickel-particle film, resulting in manufacturing an adhesive film from the liquid solution. The adhesive film is applied to an Ni/Au-plating Cu-circuit printed board, and chips are set thereon. The bump of the chip is aligned with the Ni/Au-plating Cu-circuit printed board, heated and pressed for connection. COPYRIGHT: (C)2008,JPO&INPIT
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