WATER REPELLENT AGENT, METHOD FOR WATER REPELLENT TREATMENT

摘要

PROBLEM TO BE SOLVED: To apply an adhesive at a prescribed position on the surface of a mounting board easily in good selectivity so as to be able to perform self-alignment easily in position adjustment of electronic components and the mounting board. SOLUTION: A method for manufacturing an electronic component package comprises a water repellent treatment process for attaching a water repellent agent on the surface of the mounting board for electronic components and a process for applying a hydrophilic adhesive for sticking the electronic components with the mounting board on the surface which has been subjected to the water repellent treatment, wherein the water repellent agent preferably contains particles having a mean particle diameter of 1-100 nm and a contact angle with water of≥100°. COPYRIGHT: (C)2008,JPO&INPIT