LASER-BEAM MACHINING METHOD OF PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board for reduction in both manufacturing period and manufacturing cost.

SOLUTION: A hole 5 reaching a land 3a and a groove 6 (second position) to form a line are formed at the position where the land 3a is arranged by scanning the excimer laser (second laser) having a rectangular beam shape via a mask, after formation of a hole 5a in the depth h from the front surface with irradiation of the CO2laser (first laser) to a position (first position) where the land 3a of the printed circuit board 1 including the front surface formed of an insulating layer 2 is arranged. In this case, it is also allowed to form a hole 5 reaching the land 3a from the front surface with the CO2laser.

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