| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a reliable semiconductor device which can minimize an open-circuited failure caused when a lead-free solder is used. <P>SOLUTION: In a semiconductor device 1 having a circuit wiring board 20 and a semiconductor package 10 mounted thereto, an electrode 21 patterned on the surface of the circuit wiring board 20 and solders 11 formed on the semiconductor package 10 into an array as electrode terminals are electrically connected via intermediate layers 30. The intermediate layer 30 is formed by thermally treating the structure to grow on the electrode 21, and contains both the main component of the solder 11 and the main component of the electrode 21. Consequently, a stress applied to the solder 11 can be reduced and therefore there can be obtained the reliable semiconductor device 1 which prevents an open-circuited failure. <P>COPYRIGHT: (C)2008,JPO&INPIT |
