发明名称 METHOD FOR MANUFACTURING COIL TYPE ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a coil type electronic component, which prevents the generation of burrs in the case of forming an outer packaging resin part. SOLUTION: The method for manufacturing the coil type electronic component involved in this invention comprises processes of: forming a core 4 having one core part 4a and a pair of flanges 4b, 4c arranged on both the ends of the core part 4a and composed of a magnetic substance or a non-magnetic substance; forming a coil part 10 by winding a wire 10a around the core part 4a; coating at least a part of the outer periphery of the coil part 10 with a semicured resin sheet 30a and arranging first side faces 100 out of sides faces included in respective flanges 4b, 4c and at least a part of the semicured resin sheet 30a on the same plane; and forming an outer packaging resin part 30 by completely curing the semicured resin sheet 30a. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008147520(A) 申请公布日期 2008.06.26
申请号 JP20060334897 申请日期 2006.12.12
申请人 TDK CORP 发明人 SHIMURA KOJI;SASAKI HITOSHI;URABE DAISUKE
分类号 H01F41/12 主分类号 H01F41/12
代理机构 代理人
主权项
地址