| 摘要 |
PROBLEM TO BE SOLVED: To normally solder terminals of an FFC to lands of a substrate at low cost without short-circuiting. SOLUTION: A film 6 having thermal expansion and insulation that is softened and expanded at the temperature of melted solder is attached onto one surface not facing lands 1a-1c of a main substrate 1 for terminals 3a-3c exposed from the insulator 3m of an FFC 3, and the one surface and an interface are covered with the film 6. The other surface not covered with the film 6 of the terminals 3a-3c is placed on lands 1a-1c, respectively, and the solder 7 is melted by a solder iron 8. The melted solder is put into the remaining part of the lands 1a-1c that is not in contact with the terminals 3a-3c, so as to solder the terminals 3a-3c to the lands 1a-1c. COPYRIGHT: (C)2008,JPO&INPIT
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