摘要 |
A system and method for the integration of lead frame technology within an electro-mechanical switching device. An integrated thermostat system can be formed, which includes a lead frame substrate, at least one electro-mechanical lead frame configured upon said lead frame substrate, and an electro-mechanical switching device associated with the electro-mechanical lead frame, wherein the electro-mechanical lead frame is integrated with said electro-mechanical switching device within said electro-mechanical switching device. A thermal response component is generally associated with said electro-mechanical switching device
|