| 摘要 |
A semiconductor package and a manufacturing method thereof are provided to reduce a thickness thereof by lowering a mold height to a highest chip component of chip components. One or more chip components(120) are mounted on a substrate(110). An adhesive member(124) is attached on a surface of the highest chip component of the chip components. A molding process is performed in a different height level to the highest chip component and the chip components except the highest chip component in order to protect the chip components. A polishing process is performed at the adhesive member height by using mold members(130,131). The polishing process is performed to expose a surface of the adhesive member. |
