发明名称 |
METHOD FOR MANUFACTURING MEMORY CARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a memory card which can meet the need of increasing a storage capacity and is advantageous to the reduction of manufacturing cost. <P>SOLUTION: The method for manufacturing a memory card comprises steps for: providing a member 34 for substrate molding configured of a substrate 14 and an external board 32 connected through an arm 30 to the substrate 14; positioning the substrate 14 so that the substrate 14 can be positioned in a cavity 38C and placing the member 34 for substrate molding on a lower mold 38B; closing the lower mold 38B and an upper mold 38A and sandwiching the arm 30 by those molds 38; injecting a synthetic resin material in a fusing state into the cavity 38C thereby molding a memory card 10 connected through the arm 30 to the external board 32; opening the mold 38 after the synthetic resin material is hardened, and extracting the member 34 for substrate molding in which the memory card 10 has been molded; and cutting the arm 30 and separating it from the external board 32 thereby obtaining the memory card 10. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008146540(A) |
申请公布日期 |
2008.06.26 |
申请号 |
JP20060335518 |
申请日期 |
2006.12.13 |
申请人 |
SONY CORP;RENESAS TECHNOLOGY CORP |
发明人 |
AOKI SADATAKA;TSUTSUI KEIICHI;NISHIZAWA HIROTAKA;WADA TAMAKI |
分类号 |
G06K19/077;B29C33/14;B29C45/14;B42D15/10 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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