| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a carrier for a substrate improved in operator handling property and draining property. <P>SOLUTION: The carrier comprises a bottom plate 1 and a top plate 20 opposing each other so as to house a plurality of semiconductor wafers W, a plurality of side plates 30 connecting both side parts of the bottom plate 1 and the top plate 20, and a pair of connection columns 40 connecting back surface parts of the bottom plate 1 and the top plate 20. A part between the front surface parts of the bottom plate 1 and the top plate 20 is turned to a take-in/take-out port 50 for the semiconductor wafers W, a plurality of support pieces 31 supporting the side part peripheral edge of the semiconductor wafer W are arranged side by side at a prescribed pitch on the respective side plates 30, and a plurality of control pieces 41 for interfering with the rear part peripheral edge of the semiconductor wafer W are arranged side by side at a prescribed pitch on the respective connection columns 40. Then, the inner surfaces 5/21 of the bottom plate 1 and the top plate 20 are inclined at the angle of 0.5°-3.0°respectively so as to be gradually widened as approaching the take-in/take-out port 50 for the semiconductor wafer W from the back surface direction, and holding areas 6/22 for manual operations are respectively formed at the outer surface peripheral edge of the bottom plate 1 and the top plate 20. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
