| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with a heat sink having a structure in which the semiconductor device closely attached on the heat sink can be easily separated from the heat sink without damaging the semiconductor device. SOLUTION: When a screw 5D screwed in a fixed surface 2B of the heat sink 2 is unscrewed in the direction opposite to the screwing direction, a plate spring 5B compressed and deformed between a clamp 5A and a fixed surface 2B of the heat sink 2 presses the clamp 5A upward so that the clamp is separated from the fixed surface 2B of the heat sink 2 using its elastic restoring force. Then, the pressing force acts to the lower surface of an engaging protruding portion 1D of the semiconductor device 1 from a lower wall portion 5A4 of an engaging groove 5A2 of the clamp 5A, thereby unforcedly raising a heat radiating surface 1B of the semiconductor device 1 from a heat receiving surface 2A of the heat sink 2, and thus, the semiconductor device 1 is easily separated from the heat sink 2 without being damaged. COPYRIGHT: (C)2008,JPO&INPIT
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