THERMAL MANAGEMENT OF DIES ON A SECONDARY SIDE OF A PACKAGE

摘要

An apparatus including a first die mounted on a primary side of an electronic package and a second die mounted on a secondary side of the electronic package between the electronic package and a printed circuit board. The apparatus further comprising a thermal component thermally connected to the second die and mounted on the printed circuit board, the thermal component comprising a set of pins extending from a heat sink through a set of through-holes in the printed circuit board. A method including positioning a set of thermal connectors through a printed circuit board, the thermal connectors extending from a primary side of the printed circuit board to a secondary side of the printed circuit board opposite the primary side. The method further including thermally connecting the thermal connectors to a die positioned between an electronic package and the primary side of the printed circuit board to transfer heat from the die to the secondary side of the printed circuit board.