VERTICAL INTEGRATION OF PASSIVE COMPONENT IN SEMICONDUCTOR DEVICE PACKAGE FOR HIGH ELECTRICAL PERFORMANCE

摘要

A high performance package and methods for its assembly are disclosed. A semiconductor package system of the invention is assembled in a method including the steps of affixing one or more spacers to a package substrate (12) and affixing one or more passive components to the substrate adjacent to the spacers (14) in order to define a plane. A semiconductor chip (22) is affixed in the plane atop the one or more passive components (20) and spacers and is electrically coupled to the one or more passive components.