| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide such a method of processing a piezoelectric vibrating-reed that a connection part between the piezoelectric vibrating-reed and a wafer has sufficient strength after processing for outer shape by etching, and a portion projecting from a visible outline of the piezoelectric vibrating-reed does not remain when the piezoelectric vibrating-reed from the wafer is folded and cut off. <P>SOLUTION: The outer shape of the crystal vibrating-reed is processed by photo-etching while a connection section 13 with a frame section 14 of a crystal wafer 11 is left. By half etching the connection part between a basis end 12a of the crystal vibrating-reed and the connection section from both sides, recessed grooves 16a, 16b are linearly formed to provide a thin part along the visible outline 15 of the crystal vibrating-reed. Both recessed grooves are disposed in the direction orthogonal to the width direction of the connection section while slightly shifting one recessed groove to a basis end side. After an electrode layer on the surface of a crystal element piece 12 in the state of a wafer is formed, each crystal vibrating-reed is made to separate from the wafer by folding and cutting off along the visible outline using the thin part. <P>COPYRIGHT: (C)2008,JPO&INPIT |
