| 摘要 |
PROBLEM TO BE SOLVED: To reduce the influence of warpage of a metal plate due to the tolerance of stacked parts, concerning the method of manufacturing a semiconductor device wherein a first metal plate, a semiconductor element, a metal block, and a second metal plate are stacked sequentially, and they are bonded by means of solder therebetween. SOLUTION: In a bonding step where the outer faces 22 and 23 of both metal plates 20 and 30 in the laminate 100 are supported by jigs 200 and 300 and they are soldered; a contact face 310 to be brought into contact with the outer face 32 of the second metal plate 30 in the second jig 300 is provided at a position overlapping a region, where a semiconductor element 10 and a metal block 40 in the laminate 100 are stacked, so that it is not provided at other positions that do not overlap the region where the semiconductor element 10 and the metal block 40 in the laminate 100 are stacked. COPYRIGHT: (C)2008,JPO&INPIT |
