| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate film for dicing wherein its cutting waste associated with the dicing process of a semiconductor wafer (the thread form or mustache form waste generated from a film after dicing) is rarely generated and its static electricity removing performance is excellent, and to provide a dicing film. SOLUTION: The first layer of the multilayer substrate film for dicing contains the resin composition 100 pts.wt. comprising a styrene-butadiene copolymer (SEBS) 30-80 wt.% and a polypropylene-based resin (PP) 20-70 wt.% and contains an antistatic agent 10-45 pts.wt. The second layer contains the resin composition comprising the SEBS 40-90 wt.% and the PP 10-60 wt.%. The third layer contains a thermoplastic resin having a rubber elasticity. The first, second, and third layers are laminated in this order. COPYRIGHT: (C)2008,JPO&INPIT |
