| 摘要 |
PROBLEM TO BE SOLVED: To provide a ball feeding device for a ball forming a solder bump in a semiconductor wafer and an electronic circuit substrate, and to provide a ball depositing apparatus using the same. SOLUTION: Regarding the ball feeding method, a ball feeding device 10 is rotated by 180°, and thereafter, the ball feeding device 10 is reversed and is returned to the original state, thus balls 20 are weighed, and are exhausted. The ball feeding device 10 is composed of: a ball weighing cavity 27 formed on one side of two plates; a ball separation/storage cavity 29; and a passage allowing them to communicate with each other. The ball depositing apparatus deposits the balls 20 fed from the ball feeding device 10 onto a substrate via the opening of a mask. COPYRIGHT: (C)2008,JPO&INPIT |
