发明名称 Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate
摘要 A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.
申请公布号 US2008151515(A1) 申请公布日期 2008.06.26
申请号 US20070797236 申请日期 2007.05.02
申请人 ENDICOTT INTERCONNECT TECHNOLOGIES, INC. 发明人 DAS RABINDRA N.;LAUFFER JOHN M.;MARKOVICH VOVA R.
分类号 H05K1/16;H05K1/18;H05K3/10 主分类号 H05K1/16
代理机构 代理人
主权项
地址