| 摘要 |
A vacuum apparatus such as PM 400 or LMM 500 includes: a chamber to transfer or process a wafer; a plurality of movable parts in the chamber; a high-voltage power supply 485 to introduce a high voltage HV to the chamber; a gas supply unit 445 to supply a gas to the chamber; and an exhaust mechanism 490 to exhaust a purge gas in the chamber. The vacuum apparatus is cleaned by supplying the purge gas from the gas supply unit 445 and exhausting the purge gas in the chamber via the exhaust mechanism 490 , repeating a motion of each movable part, and controlling the purge-gas pressure to be equal to or more than a predetermined pressure before and/or during and/or after the repeated motions of each movable part, and/or allowing the power supply 485 to intermittently output the HV before and/or after the motions of each movable part.
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