Semiconductor component for utilities, has substrate, which has upper side and lower side, and semiconductor chip that is mounted on substrate, with front side and back side

摘要

The semiconductor component has a substrate (8), which has an upper side (9) and a lower side (10). A semiconductor chip (4) is mounted on the substrate, with a front side (5) and a back side (6). The flip-chip-contacts are arranged on contact surface of the front side. The front side of the semiconductor chip and the upper side of the substrate have a coating made of silane and metal organic molecules. An independent claim is also included for a method for manufacturing a semiconductor component, which involves providing a substrate with an upper side and a lower side.