METHODS AND APPARATUS FOR RELEASABLY MOUNTING A SEMICONDUCTOR DEVICE TO A PRINTED CIRCUIT BOARD

摘要

Methods and apparatus for releasably mounting a semiconductor device, such as a ball grid array (BGA) integrated circuit to a printed circuit board (PCB) are disclosed. The socket (10) includes a base (12) mountable over a contact pad of the printed circuit board (24) and having an opening (20) to receive the semiconductor device (22). A socket board is mountable to or integrally formed with the base. The socket board includes at least one aperture having a spring contact for electrically coupling a contact element of the semiconductor device to a contact of the printed circuit board when the semiconductor device is received in the base.