发明名称 POWER SUPPLY INTEGRATED SEMICONDUCTOR MODULE, AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a power supply integrated semiconductor module housing a small battery having a satisfactory output characteristics. <P>SOLUTION: The power supply integrated semiconductor module comprises an insulating substrate 1; a semiconductor element 2 provided on the insulating substrate; a separator 7 provided on the insulating substrate and separating a positive electrode 5, a negative electrode 6, and the positive and the negative electrode; a nonaqueous electrolyte impregnated in the positive electrode, a negative electrode, and a separator, mainly comprising an ionic liquid; a nonaqueous electrolyte battery 4 for driving the semiconductor element; and a sealing resin 10 provided to cover the semiconductor element and the nonaqueous electrolyte battery. Either of the positive pole, the negative pole, or the separator contacts with the insulating substrate and the sealing resin. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008147391(A) 申请公布日期 2008.06.26
申请号 JP20060332341 申请日期 2006.12.08
申请人 TOSHIBA CORP 发明人 KUBOKI TAKASHI;KISHI TAKASHI;HOTTA YASUYUKI;MIKOSHIBA SATOSHI;EGUCHI TOMOKO;KOBAYASHI TAKASHI
分类号 H01L25/00;H01L23/12;H01M2/02;H01M2/08;H01M2/10;H01M2/16;H01M4/02;H01M4/485;H01M10/05;H01M10/0568;H01M10/058 主分类号 H01L25/00
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