发明名称 SUBSTRATE TREATMENT EQUIPMENT AND SUBSTRATE TRANSFER METHOD, AS WELL AS, COMPUTER PROGRAM
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment equipment which can transfer a substrate at a predetermined position in a treatment chamber by a transferring a device, with high accuracy, and to provide a substrate transfer method. SOLUTION: The substrate treatment equipment includes a treatment chamber which holds a substrate-mounting bed and carries out a predetermined treatment for a substrate on the substrate mounting bed; a temperature sensor for detecting the temperature of the treatment chamber; and a transfer device which receives/delivers the substrate for the substrate-mounting bed in the treatment chamber. The transferring device has a transfer control portion for controlling the transfer of substrate, and the transfer control portion corrects the reference position of the transferring device body in the treatment chamber, with a predetermined timing corresponding to the variation in the treatment chamber, that corresponds to the temperature detected by the temperature sensor, and controls the transfer of substrate of the transfer device body with the corrected reference position as the reference. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008147483(A) 申请公布日期 2008.06.26
申请号 JP20060334176 申请日期 2006.12.12
申请人 TOKYO ELECTRON LTD 发明人 AMANO KENJI;OKABE SEIJI
分类号 H01L21/677;C23C16/44;H01L21/3065 主分类号 H01L21/677
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