| 摘要 |
The invention relates to a process of treating a structure for electronics or optoelectronics, wherein the structure that has a substrate, a first oxide layer, an intermediate layer, a second oxide layer made of an oxide of a semiconductor material, and a thin semiconductor layer made of the semiconductor material. The process includes a heat treatment of the structure in an inert or reducing atmosphere with a temperature and a duration chosen for inciting an amount of oxygen of the second oxide layer to diffuse through the semiconductor layer so that the thickness of the second oxide layer decreases by a determined value. The invention also relates to a process of manufacturing a structure for electronics or optoelectronics through the use of this type of heat treatment.
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