SEMICONDUCTOR INTEGRATED CIRCUIT HAVING HEAT RELEASE PATTERN
摘要
<p>Provided are a semiconductor integrated circuit having a heat release pattern in a chip so as to release heat generated inside the chip and a system board having a heat release unit used to release heat generated inside the semiconductor integrated circuit. The semiconductor integrated circuit includes: one or more output pads directly connected to an output terminal having a heat release pattern; a power supply pad supplying power; and one or more dummy pads connected to a metal line for supplying power or an internal output terminal of an internal function block, wherein the heat release pattern includes a plurality of unit contacts at the output terminal or a plurality of strip contacts having an area of about or larger than the sum of two or more of the unit contacts.</p>
申请公布号
WO2008075838(A1)
申请公布日期
2008.06.26
申请号
WO2007KR05979
申请日期
2007.11.26
申请人
SILICON WORKS CO., LTD;NA, JOON HO;HAN, DAE KEUN;KIM, DAE SEONG