发明名称 COPPER-BASED SLIDE MATERIAL AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a copper-based slide material which has a high strength as a copper alloy even when a passive oxide film forming element is contained and is suitable for use in a bearing for supporting dynamic load, and its manufacturing method. SOLUTION: In the copper-based slide material, a slide layer is formed by splaying the powder of the copper alloy on a steel base metal and then sintering it. The copper alloy has a composition containing 0.1-10% by mass of at least one of Al, Si, Cr, Ti, V, Ta, Zr, and Nb and the powder thereof is obtained by nitriding atomized powder of the copper alloy at 100-200°C. The slide layer is formed by sintering the copper alloy powders, so that only the passive oxide film forming element existing on the powder surface is stabilized as a nitride without nitriding the copper composition itself. As a result, the powder surface is prevented from being covered with the passive oxide film of an additive element during temperature rising for sintering, so that a firm sintering of copper alloy can be achieved. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008144253(A) 申请公布日期 2008.06.26
申请号 JP20060336191 申请日期 2006.12.13
申请人 DAIDO METAL CO LTD 发明人 TSUJIMOTO KENTARO;ZUSHI KOJI;ISHIKAWA HIDEO
分类号 B22F7/04;B22F1/00;B22F5/00;B22F7/00;B22F9/08;C22C9/00;C22C9/01;C22C9/08;C22C9/10;C23C8/24;F16C33/12;F16C33/14 主分类号 B22F7/04
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