发明名称 ELECTROLESS GOLD PLATING BATH, ELECTROLESS GOLD PLATING METHOD, AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electroless gold plating bath in which a base metal to be plated is not eroded, the electroless gold plating can be performed at a consistent precipitation rate, the precipitation rate is high, the plating film can be increased only with one liquid due to the substitution/reduction type, a lemon-yellow color specific to gold can be maintained without degradation of the color of the film, and the appearance is excellent. SOLUTION: The electroless gold plating bath contains a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound expressed by R<SB>1</SB>-NH-C<SB>2</SB>H<SB>4</SB>-NH-R<SB>2</SB>or R<SB>3</SB>-(CH<SB>2</SB>-NH-C<SB>2</SB>H<SB>4</SB>-NH-CH<SB>2</SB>)<SB>n</SB>-R<SB>4</SB>(R<SB>1</SB>-R<SB>4</SB>denote -OH, -CH<SB>3</SB>, -CH<SB>2</SB>OH, -C<SB>2</SB>H<SB>4</SB>OH, -CH<SB>2</SB>N(CH<SB>3</SB>)<SB>2</SB>, -CH<SB>2</SB>NH(CH<SB>2</SB>OH), -CH<SB>2</SB>NH(C<SB>2</SB>H<SB>4</SB>OH), -C<SB>2</SB>H<SB>4</SB>NH(CH<SB>2</SB>OH), -C<SB>2</SB>H<SB>4</SB>NH(C<SB>2</SB>H<SB>4</SB>OH), -CH<SB>2</SB>N(CH<SB>2</SB>OH)<SB>2</SB>, -CH<SB>2</SB>N(C<SB>2</SB>H<SB>4</SB>OH)<SB>2</SB>, -C<SB>2</SB>H<SB>4</SB>N(CH<SB>2</SB>OH)<SB>2</SB>or -C<SB>2</SB>H<SB>4</SB>N(C<SB>2</SB>H<SB>4</SB>OH)<SB>2</SB>, where n denotes an integer of 1 to 4). COPYRIGHT: (C)2008,JPO&amp;INPIT
申请公布号 JP2008144188(A) 申请公布日期 2008.06.26
申请号 JP20060328895 申请日期 2006.12.06
申请人 C UYEMURA & CO LTD 发明人 KISO MASAYUKI;SAIJO YOSHIJI;KAMITAMARI TORU
分类号 C23C18/44;H01L21/28;H01L21/288;H05K3/24 主分类号 C23C18/44
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