发明名称 ELECTROLESS GOLD PLATING BATH, ELECTROLESS GOLD PLATING METHOD, AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electroless gold plating bath capable of depositing a gold plating film which does not cause any defective appearance attributable to the progression of intergranular erosion of a nickel surface, and having excellent film appearance. SOLUTION: The electroless gold plating bath contains a water-soluble gold compound, a complexing agent, a formaldehyde bisulfite adduct, and an amine compound expressed by R<SB>1</SB>-NH-C<SB>2</SB>H<SB>4</SB>-NH-R<SB>2</SB>or R<SB>3</SB>-(CH<SB>2</SB>-NH-C<SB>2</SB>H<SB>4</SB>-NH-CH<SB>2</SB>)<SB>n</SB>-R<SB>4</SB>(R<SB>1</SB>-R<SB>4</SB>denote -OH, -CH<SB>3</SB>, -CH<SB>2</SB>OH, -C<SB>2</SB>H<SB>4</SB>OH, -CH<SB>2</SB>N(CH<SB>3</SB>)<SB>2</SB>, -CH<SB>2</SB>NH(CH<SB>2</SB>OH), -CH<SB>2</SB>NH(C<SB>2</SB>H<SB>4</SB>OH), -C<SB>2</SB>H<SB>4</SB>NH(CH<SB>2</SB>OH), -C<SB>2</SB>H<SB>4</SB>NH(C<SB>2</SB>H<SB>4</SB>OH), -CH<SB>2</SB>N(CH<SB>2</SB>OH)<SB>2</SB>, -CH<SB>2</SB>N(C2H<SB>4</SB>OH)<SB>2</SB>, -C<SB>2</SB>H<SB>4</SB>N(CH<SB>2</SB>OH)<SB>2</SB>or -C<SB>2</SB>H<SB>4</SB>N(C<SB>2</SB>H<SB>4</SB>OH)<SB>2</SB>, where n denotes an integer of 1 to 4). COPYRIGHT: (C)2008,JPO&amp;INPIT
申请公布号 JP2008144187(A) 申请公布日期 2008.06.26
申请号 JP20060328891 申请日期 2006.12.06
申请人 C UYEMURA & CO LTD 发明人 KISO MASAYUKI;ODA YUKINORI;KUROSAKA SEIGO;KAMITAMARI TORU;SAIJO YOSHIJI;TANABE KATSUHISA
分类号 C23C18/44;H01L21/28;H01L21/288;H05K3/24 主分类号 C23C18/44
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