| 摘要 |
PROBLEM TO BE SOLVED: To provide heat treatment equipment whose substrate to be treated is suppressed from warping, for uniform cooling process. SOLUTION: The heat treatment equipment comprises a heating chamber 60 that includes a heat plate 64 for heating a semiconductor wafer W, a cooling plate 50 for cooling the wafer that has been heated in the heating chamber, and a transporting means 70 which carries in/out a wafer from the heating chamber. The cooling plate includes a cooling piping 58 which is a coolant path, a plurality of projections 51 for placing a wafer with a gap against the surface of the cooling plate, and a sucking hole 52 which is provided near the projection to be connected to a sucking means. COPYRIGHT: (C)2008,JPO&INPIT
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