发明名称 FILM-FORMING COMPOSITION, INSULATING FILM AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a film-forming composition which has a low dielectric constant and an excipient mechanical strength useful for an interlayer insulating film of an electronic device, etc. , and forms an interlayer insulating film having an excellent film stability with time. SOLUTION: The film-forming composition comprises (A) a compound having a cage type structure and (B) a compound containing a group represented by general formula (1) (wherein, Ar<SB>1</SB>and Ar<SB>2</SB>are each an aromatic hydrocarbon group and may be mutually the same or different). The coating solution composed of the film-forming composition is used to give the interlayer insulating film of an electronic device and an electronic device having the insulating film as a layer constituent layer. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008143940(A) 申请公布日期 2008.06.26
申请号 JP20060329505 申请日期 2006.12.06
申请人 FUJIFILM CORP 发明人 KUBO YOHEI;WATANABE KATSUYUKI
分类号 C08F38/00;H01L21/312 主分类号 C08F38/00
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