发明名称 |
Chip-probing and bumping solutions for stacked dies having through-silicon vias |
摘要 |
A method of forming a semiconductor structure includes providing a stack structure having a first side and a second side opposite the first side. The stack structure includes a bottom wafer comprising a substrate; a plurality of through-silicon vias in the substrate; and a plurality of under bump metallurgies (UBMs) connected to the plurality of through-silicon vias, wherein the UBMs are on the first side of the stack structure. The method further includes attaching a handling wafer on the second side of the stack structure; performing a chip probing process; and removing the handling wafer from the stack structure.
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申请公布号 |
US2008153187(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
US20060644397 |
申请日期 |
2006.12.21 |
申请人 |
LUO WEN-LIANG;KUO YUNG-LIANG;CHENG HSU MING |
发明人 |
LUO WEN-LIANG;KUO YUNG-LIANG;CHENG HSU MING |
分类号 |
H01L21/66;G01R31/26 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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