发明名称 |
MICROELECTRONIC DEVICE INCLUDING BRIDGING INTERCONNECT TO TOP CONDUCTIVE LAYER OF PASSIVE EMBEDDED STRUCTURE AND METHOD OF MAKING SAME |
摘要 |
<p>A microelectronic device, a method of fabricating the device, and a system including the device. The device includes: a substrate including a polymer build-up layer, and a passive structure embedded in the substrate. The passive structure includes a top conductive layer overlying the polymer build-up layer, a dielectric layer overlying the top conductive layer, and a bottom conductive layer overlying the dielectric layer. The device further includes a conductive via extending through the polymer build-up layer and electrically insulated from the bottom conductive layer, an insulation material insulating the conductive via from the bottom conductive layer, and a bridging interconnect disposed at a side of the top conductive layer facing away from the dielectric layer, the bridging interconnect electrically connecting the conductive via to the top conductive layer.</p> |
申请公布号 |
WO2008076659(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
WO2007US86665 |
申请日期 |
2007.12.06 |
申请人 |
INTEL CORPORATION;SALAMA, ISLAM;SEH, HUANKIAT;MIN, YONGKI |
发明人 |
SALAMA, ISLAM;SEH, HUANKIAT;MIN, YONGKI |
分类号 |
H05K3/42;H05K3/46 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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