| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain an IC chip mounting package in which exfoliation of the inner lead and the wrinkles of a tape can be prevented. <P>SOLUTION: In the IC chip mounting package 1, a film base material 2 and an IC chip 3 are connected via an interposer 4. Connecting terminals of the interposer 4, on the side of the film base material 2, are formed so as to have a pitch larger than that of the connecting terminals on the side of the IC chip 3. A device hole 8 is provided to the film base material 2, and the IC chip 3 is arranged in the device hole 8. The distance (A), between an inner lead end and the edge of the device hole 8 on the film base material 2, is set at not less than 10 μm. <P>COPYRIGHT: (C)2008,JPO&INPIT |
