| 摘要 |
PROBLEM TO BE SOLVED: To obtain a copper clad laminated body which has a high adhesive force between a conducting body and an insulating body, is excellent in electromigration resistance, can perform a micro-machining in a pitch of 30μm or less, and is excellent in flex resistance. SOLUTION: In the manufacturing method of the flexible copper clad laminate where a polyimide resin layer is formed on one side surface of a copper foil layer, when an analysis measurement is performed by a secondary ion mass analysis (SIMS) as the copper foil, the manufacturing method comprises a step which prepares an electrolytic copper foil where a carbon peak intensity is 4.0 or less with respect to a copper peak intensity of 50.0, the thickness is within a range of 5μm-35μm and an average crystal grain diameter of the copper foil before heat treatment is less than 2μm, a step where a polyimide precursor resin solution is applied on the prepared copper foil and the polyimide resin layer is formed by performing drying and curing through the heat treatment at 300-400°C, and a step for removing the copper foil thickness of 10-90% by chemically polishing the copper foil layer surface not contacting with the polyimide resin layer. COPYRIGHT: (C)2008,JPO&INPIT |
