发明名称 METHOD OF EVALUATING FINE METAL BONDING PORTION
摘要 PROBLEM TO BE SOLVED: To provide a method of evaluating a fine metal bonding portion having high evaluation reliability, offerable comparatively inexpensively, and capable of evaluating the quality of a bonding state un-evaluatable by a conventional image inspection method or the like. SOLUTION: A bonded portion of one bonded member between bonded metal members is heated up to a prescribed temperature, and the quality of the bonding state of the bonding portion is evaluated by using a heat transfer quantity from a heating point to the other bonded member as an index. The evaluation of the quality using the heat transfer quantity as the index is performed by heating the heating point up to the prescribed temperature, and by comparing a temperature change until the temperature at the heating point is lowered to a prescribed temperature after stop of heating with a temperature change used as a reference. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008145344(A) 申请公布日期 2008.06.26
申请号 JP20060334713 申请日期 2006.12.12
申请人 SHINKO:KK 发明人 MATSUMOTO JUN
分类号 G01N25/72 主分类号 G01N25/72
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