| 摘要 |
Problem In a flip chip mounting method by a no-flow underfill, when a resin highly filled with the filler is pre-coated on a substrate, a bump is brought into reliable contact with a pad electrode without sandwich the filler between the bump of a semiconductor and the pad electrode on the substrate to make it possible to reliably perform reflow soldering. Solving Means In a flip chip mounting method by a no-flow underfill in which resin is pre-coated on a substrate 52 , and, thereafter, a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51 , a resin 54 a highly filled with the filler 55 is applied to a region except for the pad electrode 53 on the substrate 52 , a resin 54 b being free from the filler is applied to a pad electrode 53 portion on the substrate 52 , and, thereafter, the semiconductor 50 with bump is mounted at a predetermined position on the substrate 52. |
