发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR RESIST PATTERN FORMATION, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD |
摘要 |
<p>This invention provides a photosensitive resin composition comprising (A) a binder polymer comprising a divalent group represented by general formula (I), a divalent group represented by general formula (II), and a divalvent group represented by general formula(III), (B) a photopolymerizable compound, and (C) a photopolymerization initiator comprising a hexaarylbiimidazole compound containing at least one alkoxy group having 1 to 5 carbon atoms. (I) (II) (III) wherein R<SUP>1</SUP>, R<SUP>3</SUP>, and R<SUP>5</SUP> each independently represent a hydrogen atom or a methyl group; R<SUP>2</SUP> and R<SUP>4</SUP> each independently represent an alkyl group having 1 to 3 carbon atoms, an alkoxy group, an OH group, or a halogen atom; and m and n are each independently an integer of 0 to 5.</p> |
申请公布号 |
WO2008075531(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
WO2007JP72623 |
申请日期 |
2007.11.22 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD.;MURAMATSU, YUKIKO;MIYASAKA, MASAHIRO;NANKAWA, HANAKO |
发明人 |
MURAMATSU, YUKIKO;MIYASAKA, MASAHIRO;NANKAWA, HANAKO |
分类号 |
G03F7/004;G03F7/031;G03F7/033 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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