| 摘要 |
<p>[PROBLEMS] To provide a wiring board, which permits plating to be performed over the entire surface of a castellation conductor in a state of a large substrate for taking out many wiring boards, and can be excellently divided from the substrate, and to provide a method for manufacturing such wiring board. [MEANS FOR SOLVING PROBLEMS] A large substrate (28) is divided into many wiring boards (11). In the wiring board, a castellation conductor (15) is arranged in notches (13, 14) on the side surface of a ceramic substrate (12). A plating layer (16) is applied on the entire surface of the castellation conductor (15). The both end portions of the notches (13, 14) in the width direction, however, are exposed wall surfaces (13a, 14a) not coated with the castellation conductor (15). Therefore, each castellation conductor (15) is separated from the side surface of the ceramic substrate (12).</p> |
