| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve flexibility in isometric wiring by shortening the length of wire bonding, to reduce the length of wiring by using a thin-type organic wiring board and to make an entire module thin, in the laminated integral module comprised of a controller chip and a memory chip. <P>SOLUTION: A square-shaped wiring board 10 is provided between a memory chip 1 and a controller chip 2 on a BGA substrate 3, and it is used for relay of wire bonding. The wiring board 10 is arranged in a manner to surround four sides of the controller chip 2, and the wire bonding terminal of the wiring board 10 is arranged close to the wire bonding terminal of the memory chip 1 as well as the wire bonding terminal of the BGA substrate 3. <P>COPYRIGHT: (C)2008,JPO&INPIT |
