发明名称 |
Chemical mechanical polishing pad |
摘要 |
A chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad has a high modulus component forming a continuous polymeric matrix and an impact modifier within the continuous polymeric matrix. The high modulus component has a modulus of at least 100 MPa. The impact modifier includes a low modulus component having a modulus of at least one order of magnitude less than the high modulus component that increases the impact resistance of the polishing pad.
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申请公布号 |
US2008153395(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
US20060644493 |
申请日期 |
2006.12.21 |
申请人 |
KULP MARY JO;JAMES DAVID B;ANTRIM ROBERT F |
发明人 |
KULP MARY JO;JAMES DAVID B.;ANTRIM ROBERT F. |
分类号 |
B24B1/00;B24D99/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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