发明名称 |
Removal of Surface Oxides by Electron Attachment for Wafer Bumping Applications |
摘要 |
The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
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申请公布号 |
US2008149690(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
US20080042055 |
申请日期 |
2008.03.04 |
申请人 |
AIR PRODUCTS AND CHEMICALS, INC. |
发明人 |
DONG CHUN CHRISTINE;MCDERMOTT WAYNE THOMAS;SCHWARZ ALEXANDER;ARSLANIAN GREGORY KHOSROV;PATRICK RICHARD E. |
分类号 |
B23K1/20;B23K1/008;B23K35/26;B23K35/38;C23G5/00;C25F1/02;H01J37/32;H01L21/00;H01L21/311;H01L21/60 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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