发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION TECHNOLOGY |
摘要 |
An integrated circuit package system that includes: providing a support structure including an integrated circuit and an electrical contact adjacent thereto; providing a first mold having a first cavity with a projection and a recess for collecting flash; engaging the first mold on the support structure with the first cavity over at least a portion of the integrated circuit and the projection and the recess between the at least a portion of the integrated circuit and the electrical contact; and injecting encapsulation material into the first cavity. |
申请公布号 |
US2008150119(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
US20060615919 |
申请日期 |
2006.12.22 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
JANG KI YOUN;SONG SUNGMIN;BAE JOHYUN |
分类号 |
H01L23/48;H01L21/56 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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