| 摘要 |
A collective mounting method of electronic components and a manufacturing method of an electronic component-embedded substrate are provided to uniformly fix the electronic components to an insulating layer in a short time by isotropically pressing the electronic components on uncured resin through a pressure medium. A manufacturing method of an electronic component-embedded substrate includes a semiconductor collective fixing step of mounting a plurality of electronic components(220) on an uncured resin layer(212) for forming an insulating layer, simultaneously pressing the plurality of electronic components inside a vessel(31) of a pressing and heating device(3) through a pressure medium, and forming the insulating layer by heating and curing the resin; an insulating layer forming step of forming an additional insulating layer on the plurality of fixed electronic components; and a wiring layer forming step of forming a wiring layer on the additional insulating layer to be electrically connected to the plurality of electronic components. |
