发明名称 COMPOSITION FOR HEAT RADIATION SILICONE GEL AND HEAT RADIATION SILICONE SHEET OBTAINED BY CURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a composition for heat radiation silicone gel which has excellent heat radiation properties, can control physical stress, reduces oozing of a liquid silicone, and becomes to gel to exhibit excellent adhesion and tackiness to each part and a substrate when used in electrical/electronic parts, and a heat radiation silicone sheet obtained by curing the composition. <P>SOLUTION: The composition for curable heat radiation silicone gel comprises an alkenyl group-containing polyorganosiloxane, a diorganohydrogensiloxy-terminated polyorganosiloxane as a chain extender, a polyorganohydrogensiloxane as a crosslinking agent, a hydrosilylation catalyst, and a heat conductive filler, and the ratio of the number of alkenyl groups bonded to the silicon atom in the alkenyl group-containing polyorganosiloxane, the number of hydrogen atoms bonded to the silicon atom in the chain extender, and the number of hydrogen atoms bonded to the silicon atom in the crosslinking agent is specified, and the heat radiation silicone sheet is obtained by curing the composition for heat radiation silicone gel. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008143980(A) 申请公布日期 2008.06.26
申请号 JP20060330797 申请日期 2006.12.07
申请人 WACKER ASAHIKASEI SILICONE CO LTD 发明人 MATSUMOTO MAKOTO;KAMIYA MASATO
分类号 C08L83/07;C08K3/00;C08L83/05;C09K5/08 主分类号 C08L83/07
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