| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a microdevice including a functional element having a vibrator or a movable part provided on the function surface of a MEMS (Micro Electro Mechanical System) element, a SAW (Surface Acoustic Wave) element, or an F-BAR (Thin Film Bulk Acoustic Wave Resonator) is hermetically sealed, the device which is made compact by suppressing the influence of an outgas on the functional element, and also to provide a method of manufacturing the semiconductor device. SOLUTION: A first semiconductor chip 10 including a functional element 12 having a movable part of a vibrator formed on its one main surface is mounted on a second semiconductor chip 20 having a size larger than that of the first semiconductor chip 10, the first semiconductor chip 10 is inserted in a recess 38 formed in a mounting substrate 30, the second semiconductor chip 20 is mounted on the mounting substrate 30 so that the second semiconductor chip 20 closes the recess 38, and a sealing resin layer 40 is formed in a gap between the second semiconductor chip 20 and the mounting substrate 30, whereby the first semiconductor chip is accommodated to be hermetically sealed within a hollow part defined by the inner wall surface of the recess, the terminal formation surface of the second semiconductor chip, and the sealing resin layer. COPYRIGHT: (C)2008,JPO&INPIT |
